Large area spray cooling by inclined nozzles for electronic board

التفاصيل البيبلوغرافية
العنوان: Large area spray cooling by inclined nozzles for electronic board
المؤلفون: Yan, Z.B., Duan, F., Wong, T.N., Toh, K.C., Choo, K.F., Chan, P.K., Chua, Y.S., Lee, L.W.
المصدر: 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :76-78 Dec, 2010
Relation: 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781424485611
9781424485604
9781424485628
DOI:10.1109/EPTC.2010.5702609