مؤتمر
QFN wire bonder efficiency improvement through DMAIC methodology
| العنوان: | QFN wire bonder efficiency improvement through DMAIC methodology |
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| المؤلفون: | Pan, Place YJ, Tan, CE, Keith Yeong Chun Yuen |
| المصدر: | 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :726-730 Dec, 2010 |
| Relation: | 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424485611 9781424485604 9781424485628 |
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| DOI: | 10.1109/EPTC.2010.5702733 |