مؤتمر
Current crowding study of a micro spring contact for flip chip packaging
| العنوان: | Current crowding study of a micro spring contact for flip chip packaging |
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| المؤلفون: | Cheng, Bowen, Chow, Eugene M., De Bruyker, Dirk, Shubin, Ivan, Cunningham, John, Chow, Alex, Shi, Jing, Bohringer, Karl F. |
| المصدر: | 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on. :360-363 Jan, 2011 |
| Relation: | 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424496327 9781424496341 |
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| تدمد: | 10846999 |
| DOI: | 10.1109/MEMSYS.2011.5734436 |