مؤتمر
Effect of Ni metallization on interfacial reactions and die attach properties of Zn-Al-Mg-Ga high temperature lead-free solder
| العنوان: | Effect of Ni metallization on interfacial reactions and die attach properties of Zn-Al-Mg-Ga high temperature lead-free solder |
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| المؤلفون: | Haque, A., Won, Y. S., Lim, B. H., Haseeb, A. S. M. A., Masjuki, H. H. |
| المصدر: | 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International. :1-6 Nov, 2010 |
| Relation: | 2010 34th International Electronics Manufacturing Technology Conference (IEMT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424488254 9781424488261 9781424488278 |
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| تدمد: | 10898190 |
| DOI: | 10.1109/IEMT.2010.5746721 |