مؤتمر
Characterization of submicrometer thickness of copper film on silicon wafer by using pulsed eddy current method
| العنوان: | Characterization of submicrometer thickness of copper film on silicon wafer by using pulsed eddy current method |
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| المؤلفون: | Zilian Qu, Qian Zhao, Yonggang Meng |
| المصدر: | 2011 International Conference on Electric Information and Control Engineering Electric Information and Control Engineering (ICEICE), 2011 International Conference on. :1220-1223 Apr, 2011 |
| Relation: | 2011 International Conference on Electric Information and Control Engineering (ICEICE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424480364 9781424480388 9781424480395 |
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| DOI: | 10.1109/ICEICE.2011.5778190 |