مؤتمر
Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints
| العنوان: | Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints |
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| المؤلفون: | Deng, W. J., Lin, K. L., Chiu, Y. T., Lai, Y. S. |
| المصدر: | 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :114-117 May, 2011 |
| Relation: | 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781612844961 9781612844978 9781612844985 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2011.5898500 |