مؤتمر
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
| العنوان: | 3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections |
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| المؤلفون: | Maria, J., Dang, B., Wright, S. L., Tsang, C. K., Andry, P., Polastre, R., Liu, Y., Wiggins, L., Knickerbocker, J. U. |
| المصدر: | 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :268-273 May, 2011 |
| Relation: | 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781612844961 9781612844978 9781612844985 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2011.5898524 |