مؤتمر
Effects of metal-cap coverage on electro-migration (EM) tolerance for scaled-down Cu interconnects
| العنوان: | Effects of metal-cap coverage on electro-migration (EM) tolerance for scaled-down Cu interconnects |
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| المؤلفون: | Ueki, M., Nakazawa, E., Kitao, R., Hiroshima, S., Kurokawa, T., Furutake, N., Yamamoto, H., Inoue, N., Tsuchiya, Y., Hayashi, Y. |
| المصدر: | 2011 IEEE International Interconnect Technology Conference Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International. :1-3 May, 2011 |
| Relation: | Joint 2011 IEEE International Interconnect Technology Conference (IITC) & 2011 Materials for Advanced Metallization (MAM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781457705038 9781457705014 9781457705021 |
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| تدمد: | 2380632X 23806338 |
| DOI: | 10.1109/IITC.2011.5940294 |