مؤتمر
Wet process optimization to deposit conformal Cu diffusion barrier into TSV
| العنوان: | Wet process optimization to deposit conformal Cu diffusion barrier into TSV |
|---|---|
| المؤلفون: | Pernel, C., Avale, X., Veillerot, M., Hortemel, L., Leduc, P., Ritzdorf, T. |
| المصدر: | 2011 IEEE International Interconnect Technology Conference Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International. :1-3 May, 2011 |
| Relation: | Joint 2011 IEEE International Interconnect Technology Conference (IITC) & 2011 Materials for Advanced Metallization (MAM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781457705038 9781457705014 9781457705021 |
|---|---|
| تدمد: | 2380632X 23806338 |
| DOI: | 10.1109/IITC.2011.5940327 |