مؤتمر
Wet process optimization to deposit conformal Cu diffusion barrier into TSV
العنوان: | Wet process optimization to deposit conformal Cu diffusion barrier into TSV |
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المؤلفون: | Pernel, C., Avale, X., Veillerot, M., Hortemel, L., Leduc, P., Ritzdorf, T. |
المصدر: | 2011 IEEE International Interconnect Technology Conference Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International. :1-3 May, 2011 |
Relation: | Joint 2011 IEEE International Interconnect Technology Conference (IITC) & 2011 Materials for Advanced Metallization (MAM) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781457705038 9781457705014 9781457705021 |
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تدمد: | 2380632X 23806338 |
DOI: | 10.1109/IITC.2011.5940327 |