مؤتمر
TSV process optimization for reduced device impact on 28nm CMOS
العنوان: | TSV process optimization for reduced device impact on 28nm CMOS |
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المؤلفون: | Yu, C.L., Chang, C.H., Wang, H.Y., Chang, J.H., Huang, L.H., Kuo, C.W., Tai, S.P., Hou, S.Y., Lin, W.L., Liao, E.B., Yang, K.F., Wu, T.J., Chiou, W.C., Tung, C.H., Jeng, S.P., Yu, C.H. |
المصدر: | 2011 Symposium on VLSI Technology - Digest of Technical Papers VLSI Technology (VLSIT), 2011 Symposium on. :138-139 Jun, 2011 |
Relation: | 2011 IEEE Symposium on VLSI Technology |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781424499496 9784863481664 |
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تدمد: | 07431562 21589682 |