مؤتمر
Reliability of aluminum-nitride filled mold compound
| العنوان: | Reliability of aluminum-nitride filled mold compound |
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| المؤلفون: | Tracy, D., Nguyen, L., Giberti, R., Gallo, A., Bischof, C., Sweet, J.N., Hsia, A.W. |
| المصدر: | 1997 Proceedings 47th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1997. Proceedings., 47th. :72-77 1997 |
| Relation: | 1997 Proceedings 47th Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078033857X 9780780338579 |
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| تدمد: | 05695503 |
| DOI: | 10.1109/ECTC.1997.606148 |