مؤتمر
Reliability aanalysis on the solder joints in space cable connectors
| العنوان: | Reliability aanalysis on the solder joints in space cable connectors |
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| المؤلفون: | Xiao-chao, Zhang, Zhen-ming, Zhang, Meng, Yang |
| المصدر: | 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. :1-3 Aug, 2011 |
| Relation: | 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781457717680 9781457717703 9781457717697 |
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| DOI: | 10.1109/ICEPT.2011.6066973 |