مؤتمر
Characterization of barrier and seed layer integrity for copper interconnects
| العنوان: | Characterization of barrier and seed layer integrity for copper interconnects |
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| المؤلفون: | Wojcik, Henry, Lehninger, David, Neumann, Volker, Bartha, Johann W. |
| المصدر: | 2011 Semiconductor Conference Dresden Semiconductor Conference Dresden (SCD), 2011. :1-5 Sep, 2011 |
| Relation: | 2011 Semiconductor Conference Dresden (SCD) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781457704314 9781457704291 9781457704307 |
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| DOI: | 10.1109/SCD.2011.6068735 |