مؤتمر
Characterization of barrier and seed layer integrity for copper interconnects
العنوان: | Characterization of barrier and seed layer integrity for copper interconnects |
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المؤلفون: | Wojcik, Henry, Lehninger, David, Neumann, Volker, Bartha, Johann W. |
المصدر: | 2011 Semiconductor Conference Dresden Semiconductor Conference Dresden (SCD), 2011. :1-5 Sep, 2011 |
Relation: | 2011 Semiconductor Conference Dresden (SCD) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781457704314 9781457704291 9781457704307 |
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DOI: | 10.1109/SCD.2011.6068735 |