مؤتمر
Design of high reliability packaging for Fuji High Power Module
العنوان: | Design of high reliability packaging for Fuji High Power Module |
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المؤلفون: | Igarashi, S., Kakiki, H., Nishimura, Y., Goto, T. |
المصدر: | 2011 International Conference on Electrical Machines and Systems Electrical Machines and Systems (ICEMS), 2011 International Conference on. :1-6 Aug, 2011 |
Relation: | 2011 International Conference on Electrical Machines and Systems (ICEMS) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781457710445 9781457710421 9781457710438 |
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DOI: | 10.1109/ICEMS.2011.6073948 |