مؤتمر
Design of high reliability packaging for Fuji High Power Module
| العنوان: | Design of high reliability packaging for Fuji High Power Module |
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| المؤلفون: | Igarashi, S., Kakiki, H., Nishimura, Y., Goto, T. |
| المصدر: | 2011 International Conference on Electrical Machines and Systems Electrical Machines and Systems (ICEMS), 2011 International Conference on. :1-6 Aug, 2011 |
| Relation: | 2011 International Conference on Electrical Machines and Systems (ICEMS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781457710445 9781457710421 9781457710438 |
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| DOI: | 10.1109/ICEMS.2011.6073948 |