Design of high reliability packaging for Fuji High Power Module

التفاصيل البيبلوغرافية
العنوان: Design of high reliability packaging for Fuji High Power Module
المؤلفون: Igarashi, S., Kakiki, H., Nishimura, Y., Goto, T.
المصدر: 2011 International Conference on Electrical Machines and Systems Electrical Machines and Systems (ICEMS), 2011 International Conference on. :1-6 Aug, 2011
Relation: 2011 International Conference on Electrical Machines and Systems (ICEMS)
قاعدة البيانات: IEEE Xplore Digital Library