دورية أكاديمية
High Density Metal–Metal Interconnect Bonding for 3-D Integration
| العنوان: | High Density Metal–Metal Interconnect Bonding for 3-D Integration |
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| المؤلفون: | Lannon, J. M., Gregory, C., Lueck, M., Reed, J. D., Huffman, C. A., Temple, D. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(1):71-78 Jan, 2012 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2011.2175922 |