مؤتمر
Nonlinear thermal stress analyses and design guidelines for through silicon vias (TSVs) in 3D IC integration
العنوان: | Nonlinear thermal stress analyses and design guidelines for through silicon vias (TSVs) in 3D IC integration |
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المؤلفون: | Hsieh, Ming-Che, Wu, Sheng-Tsai, Li, Wei, Tain, Ra-Min, Lau, John H., Lo, Robert, Kao, Ming-Jer |
المصدر: | 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International. :75-78 Oct, 2011 |
Relation: | 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781457713880 9781457713873 9781457713897 |
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تدمد: | 21505934 21505942 |
DOI: | 10.1109/IMPACT.2011.6117209 |