مؤتمر
Determination of silicon die initial crack using acoustic emission technique
| العنوان: | Determination of silicon die initial crack using acoustic emission technique |
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| المؤلفون: | Chen, Pei-Chi, Su, Yen-Fu, Yang, Shin-Yueh, Chiang, Kuo-Ning |
| المصدر: | 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International. :83-86 Oct, 2011 |
| Relation: | 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781457713880 9781457713873 9781457713897 |
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| تدمد: | 21505934 21505942 |
| DOI: | 10.1109/IMPACT.2011.6117283 |