دورية أكاديمية
Fast Fixed-Outline 3-D IC Floorplanning With TSV Co-Placement
| العنوان: | Fast Fixed-Outline 3-D IC Floorplanning With TSV Co-Placement |
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| المؤلفون: | Li, C.-R., Mak, W.-K., Wang, T.-C. |
| المصدر: | IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 21(3):523-532 Mar, 2013 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 10638210 15579999 |
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| DOI: | 10.1109/TVLSI.2012.2190537 |