مؤتمر
Development of through glass tungsten via interconnect for 3D MEMS packaging
| العنوان: | Development of through glass tungsten via interconnect for 3D MEMS packaging |
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| المؤلفون: | Yu Sun, Daquan Yu, Shuangshou Yang, Xiaofeng Sun, Jing Zhang, Xiuzhen Wei, Lixi Wan |
| المصدر: | 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :774-776 Dec, 2011 |
| Relation: | 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781457719813 9781457719837 9781457719820 |
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| DOI: | 10.1109/EPTC.2011.6184531 |