مؤتمر
Ceramic packaging reliability study of a 13.5 kV multichip thyristor
| العنوان: | Ceramic packaging reliability study of a 13.5 kV multichip thyristor |
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| المؤلفون: | Vergne, B., Gauthier-Blum, C., Brommer, V., Scharnholz, S., Spahn, E., Welleman, A. |
| المصدر: | 2011 IEEE Pulsed Power Conference Pulsed Power Conference (PPC), 2011 IEEE. :1128-1131 Jun, 2011 |
| Relation: | 2011 IEEE Pulsed Power Conference (PPC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781457706295 9781457706301 9781457706318 |
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| تدمد: | 21584915 21584923 |
| DOI: | 10.1109/PPC.2011.6191657 |