Numerical simulation of heat generation during the back grinding process of silicon wafers

التفاصيل البيبلوغرافية
العنوان: Numerical simulation of heat generation during the back grinding process of silicon wafers
المؤلفون: Abdelnaby, A. H., Potirniche, G. P., Elshabini, A., Barlow, F., Groothuis, S. K., Parker, R. S.
المصدر: 2012 IEEE Workshop on Microelectronics and Electron Devices Microelectronics and Electron Devices (WMED), 2012 IEEE Workshop on. :1-4 Apr, 2012
Relation: 2012 IEEE Workshop on Microelectronics and Electron Devices (WMED)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781457717352
9781457717376
9781457717383
تدمد:19473834
19473842
DOI:10.1109/WMED.2012.6202614