مؤتمر
Numerical simulation of heat generation during the back grinding process of silicon wafers
العنوان: | Numerical simulation of heat generation during the back grinding process of silicon wafers |
---|---|
المؤلفون: | Abdelnaby, A. H., Potirniche, G. P., Elshabini, A., Barlow, F., Groothuis, S. K., Parker, R. S. |
المصدر: | 2012 IEEE Workshop on Microelectronics and Electron Devices Microelectronics and Electron Devices (WMED), 2012 IEEE Workshop on. :1-4 Apr, 2012 |
Relation: | 2012 IEEE Workshop on Microelectronics and Electron Devices (WMED) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781457717352 9781457717376 9781457717383 |
---|---|
تدمد: | 19473834 19473842 |
DOI: | 10.1109/WMED.2012.6202614 |