التفاصيل البيبلوغرافية
العنوان: |
OMCVD TiN diffusion barrier for copper contact and via/interconnects structures |
المؤلفون: |
Marcadal, C., Richard, E., Torres, J., Palleau, J., Ulmer, L., Perroud, L. |
المصدر: |
European Workshop Materials for Advanced Metallization, Materials for advanced metallization Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop. :54-55 1997 |
Relation: |
European Workshop Materials for Advanced Metallization. MAM'97 Abstracts Booklet |
قاعدة البيانات: |
IEEE Xplore Digital Library |