OMCVD TiN diffusion barrier for copper contact and via/interconnects structures

التفاصيل البيبلوغرافية
العنوان:	OMCVD TiN diffusion barrier for copper contact and via/interconnects structures
المؤلفون:	Marcadal, C., Richard, E., Torres, J., Palleau, J., Ulmer, L., Perroud, L.
المصدر:	European Workshop Materials for Advanced Metallization, Materials for advanced metallization Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop. :54-55 1997
Relation:	European Workshop Materials for Advanced Metallization. MAM'97 Abstracts Booklet
قاعدة البيانات:	IEEE Xplore Digital Library

الوصف
تدمد:	12660167
DOI:	10.1109/MAM.1997.621058