مؤتمر
Microstructural evolution and some unusual effects during thermo-mechanical Cycling of Sn-Ag-Cu alloys
| العنوان: | Microstructural evolution and some unusual effects during thermo-mechanical Cycling of Sn-Ag-Cu alloys |
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| المؤلفون: | Kumar, P., Talenbanpour, B., Sahaym, U., Wen, C. H., Dutta, I. |
| المصدر: | 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on. :880-887 May, 2012 |
| Relation: | 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781424495313 9781424495337 9781424495320 |
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| تدمد: | 10879870 |
| DOI: | 10.1109/ITHERM.2012.6231519 |