مؤتمر
High temperature aging of enameled copper wire — Relationships between chemical structure and electrical behavior
العنوان: | High temperature aging of enameled copper wire — Relationships between chemical structure and electrical behavior |
---|---|
المؤلفون: | Petitgas, B., Seytre, G., Gain, O., Boiteux, G., Royaud, I., Serghei, A., Gimenez, A., Anton, A. |
المصدر: | 2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on. :84-88 Oct, 2011 |
Relation: | 2011 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2011) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781457709852 9781457709845 9781457709869 |
---|---|
تدمد: | 00849162 |
DOI: | 10.1109/CEIDP.2011.6232602 |