مؤتمر
High temperature aging of enameled copper wire — Relationships between chemical structure and electrical behavior
| العنوان: | High temperature aging of enameled copper wire — Relationships between chemical structure and electrical behavior |
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| المؤلفون: | Petitgas, B., Seytre, G., Gain, O., Boiteux, G., Royaud, I., Serghei, A., Gimenez, A., Anton, A. |
| المصدر: | 2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on. :84-88 Oct, 2011 |
| Relation: | 2011 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2011) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781457709852 9781457709845 9781457709869 |
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| تدمد: | 00849162 |
| DOI: | 10.1109/CEIDP.2011.6232602 |