مؤتمر
Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP
| العنوان: | Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP |
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| المؤلفون: | Zhan, Chau-Jie, Tzeng, Pei-Jer, Lau, John H., Dai, Ming-Ji, Chien, Heng-Chieh, Lee, Ching-Kuan, Wu, Shang-Tsai, Kao, Kuo-Shu, Huang, Shin-Yi, Fan, Chia-Wen, Chung, Su-Ching, Huang, Yu-Wei, Lin, Yu-Min, Chang, Jing-Yao, Yang, Tsung-Fu, Chen, Tai-Hung, Lo, Robert, Kao, M. J. |
| المصدر: | 2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :548-554 May, 2012 |
| Relation: | 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467319645 9781467319669 9781467319652 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2012.6248883 |