Low-k interconnect stack with metal-insulator-metal capacitors for 22nm high volume manufacturing

التفاصيل البيبلوغرافية
العنوان:	Low-k interconnect stack with metal-insulator-metal capacitors for 22nm high volume manufacturing
المؤلفون:	Ingerly, D., Agrawal, A., Ascazubi, R., Blattner, A., Buehler, M., Chikarmane, V., Choudhury, B., Cinnor, F., Ege, C., Ganpule, C., Glassman, T., Grover, R., Hentges, P., Hicks, J., Jones, D., Kandas, A., Khan, H., Lazo, N., Lee, K. S., Liu, H., Madhavan, A., McFadden, R., Mule, T., Parsons, D., Parthangal, P., Rangaraj, S., Rao, D., Roesler, J., Schmitz, A., Sharma, M., Shin, J., Shusterman, Y., Speer, N., Tiwari, P., Wang, G., Yashar, P., Mistry, K.
المصدر:	2012 IEEE International Interconnect Technology Conference Interconnect Technology Conference (IITC), 2012 IEEE International. :1-3 Jun, 2012
Relation:	2012 IEEE International Interconnect Technology Conference - IITC
قاعدة البيانات:	IEEE Xplore Digital Library