مؤتمر
Low-k interconnect stack with metal-insulator-metal capacitors for 22nm high volume manufacturing
العنوان: | Low-k interconnect stack with metal-insulator-metal capacitors for 22nm high volume manufacturing |
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المؤلفون: | Ingerly, D., Agrawal, A., Ascazubi, R., Blattner, A., Buehler, M., Chikarmane, V., Choudhury, B., Cinnor, F., Ege, C., Ganpule, C., Glassman, T., Grover, R., Hentges, P., Hicks, J., Jones, D., Kandas, A., Khan, H., Lazo, N., Lee, K. S., Liu, H., Madhavan, A., McFadden, R., Mule, T., Parsons, D., Parthangal, P., Rangaraj, S., Rao, D., Roesler, J., Schmitz, A., Sharma, M., Shin, J., Shusterman, Y., Speer, N., Tiwari, P., Wang, G., Yashar, P., Mistry, K. |
المصدر: | 2012 IEEE International Interconnect Technology Conference Interconnect Technology Conference (IITC), 2012 IEEE International. :1-3 Jun, 2012 |
Relation: | 2012 IEEE International Interconnect Technology Conference - IITC |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781467311366 9781467311380 9781467311373 |
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تدمد: | 2380632X 23806338 |
DOI: | 10.1109/IITC.2012.6251663 |