دورية أكاديمية
Fluid/Structure Interaction Investigation in PBGA Packaging
| العنوان: | Fluid/Structure Interaction Investigation in PBGA Packaging |
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| المؤلفون: | Ramdan, D., Abdullah, M. Z., Khor, C., Leong, W. C., Loh, W. K., Ooi, C. K., Ooi, R. C. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(11):1786-1795 Nov, 2012 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2012.2215860 |