Fully integrated thermally actuated SOI diaphragm: Design, fabrication & characterization

التفاصيل البيبلوغرافية
العنوان: Fully integrated thermally actuated SOI diaphragm: Design, fabrication & characterization
المؤلفون: Lefevre, R., Salette, A., Montes, L., Morfouli, P., Dehan, C.
المصدر: 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) Semiconductor Conference Dresden-Grenoble (ISCDG), 2012 International. :195-198 Sep, 2012
Relation: 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) - formerly known as the Semiconductor Conference Dresden (SCD)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781467317153
9781467317177
DOI:10.1109/ISCDG.2012.6360021