مؤتمر
Software component architecture for co-simulation applied to the coupling between a building's thermal envelope and its inhabitant behaviour
| العنوان: | Software component architecture for co-simulation applied to the coupling between a building's thermal envelope and its inhabitant behaviour |
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| المؤلفون: | Gaaloul, S., Le, X.H.B., Delinchant, B., Wurtz, F., Ploix, S. |
| المصدر: | IECON 2012 - 38th Annual Conference on IEEE Industrial Electronics Society. :4860-4865 Oct, 2012 |
| Relation: | IECON 2012 - 38th Annual Conference of IEEE Industrial Electronics |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467324205 9781467324199 9781467324212 |
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| تدمد: | 1553572X |
| DOI: | 10.1109/IECON.2012.6388995 |