دورية أكاديمية
Assessment of Influence of Impedance Mismatch in ULSI Devices on Electromigration of Copper Interconnection Lines
| العنوان: | Assessment of Influence of Impedance Mismatch in ULSI Devices on Electromigration of Copper Interconnection Lines |
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| المؤلفون: | Livshits, P., Rysin, A., Sofer, S., Fefer, Y. |
| المصدر: | IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 13(1):231-235 Mar, 2013 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15304388 15582574 |
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| DOI: | 10.1109/TDMR.2012.2236556 |