دورية أكاديمية
3-D Numerical and Experimental Investigations on Compression Molding in Multichip Embedded Wafer Level Packaging
| العنوان: | 3-D Numerical and Experimental Investigations on Compression Molding in Multichip Embedded Wafer Level Packaging |
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| المؤلفون: | Ji, L., Sorono, D. V., Chai, T. C., Zhang, X. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(4):678-687 Apr, 2013 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2012.2220141 |