مؤتمر
Effect of stacking chips and fluid/structure interaction simulation in 3D stacked flip-chip encapsulation process
| العنوان: | Effect of stacking chips and fluid/structure interaction simulation in 3D stacked flip-chip encapsulation process |
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| المؤلفون: | Wong, W. C., Khor, C. Y., Ernest, O., Abdullah, M. Z., Saad, A. A., Yusop, N. Md., Loh, W. K., Ooi, C. K., Ooi, R. C. |
| المصدر: | 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :127-132 Oct, 2012 |
| Relation: | 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467316378 9781467316354 9781467316385 |
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| تدمد: | 21505934 21505942 |
| DOI: | 10.1109/IMPACT.2012.6420218 |