مؤتمر
Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging
| العنوان: | Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging |
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| المؤلفون: | Ying-Chih Wu, Yu-Jung Huang, Ming-Kun Chen, Yi-Lung Lin, Shen-Li Fu |
| المصدر: | 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :94-97 Oct, 2012 |
| Relation: | 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467316378 9781467316354 9781467316385 |
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| تدمد: | 21505934 21505942 |
| DOI: | 10.1109/IMPACT.2012.6420278 |