مؤتمر
Reliability analysis of 3D IC integration packaging under drop test condition
| العنوان: | Reliability analysis of 3D IC integration packaging under drop test condition |
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| المؤلفون: | Yen-Ju Lee, Yen-Fu Su, Tuan-Yu Hung, Kuo-Ning Chiang |
| المصدر: | 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :299-302 Oct, 2012 |
| Relation: | 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467316378 9781467316354 9781467316385 |
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| تدمد: | 21505934 21505942 |
| DOI: | 10.1109/IMPACT.2012.6420286 |