مؤتمر
Relationship between crack propagation trends and grains in SnAgCu interconnects
| العنوان: | Relationship between crack propagation trends and grains in SnAgCu interconnects |
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| المؤلفون: | Wang, C.Q., Zhong, Y., Caers, J.F.J.M., Zhao, X.J., Li, B., Liu, B.L. |
| المصدر: | 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :1200-1204 Aug, 2012 |
| Relation: | 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467316804 9781467316828 9781467316811 |
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| DOI: | 10.1109/ICEPT-HDP.2012.6474822 |