مؤتمر
Si-capping thicknesses impacting compressive strained MOSFETs with temperature effect
| العنوان: | Si-capping thicknesses impacting compressive strained MOSFETs with temperature effect |
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| المؤلفون: | Wang, Mu-Chun, Peng, Ssu-Hao, Wang, Shea-Jue, Yang, Hsin-Chia, Liao, Wen-Shiang, Li, Chao-Wang, Liu, Chuan-Hsi |
| المصدر: | 2013 International Symposium on Next-Generation Electronics Next-Generation Electronics (ISNE), 2013 IEEE International Symposium on. :361-364 Feb, 2013 |
| Relation: | 2013 International Symposium on Next-Generation Electronics (ISNE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467330367 9781467330350 9781467330374 |
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| DOI: | 10.1109/ISNE.2013.6512367 |