مؤتمر
Electromigration reliability of Mn-doped Cu interconnects for the 28 nm technology
| العنوان: | Electromigration reliability of Mn-doped Cu interconnects for the 28 nm technology |
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| المؤلفون: | Cao, Linjun, Ho, Paul S., Justison, Patrick |
| المصدر: | 2013 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2013 IEEE International. :EM.5.1-EM.5.4 Apr, 2013 |
| Relation: | 2013 IEEE International Reliability Physics Symposium (IRPS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479901111 9781479901128 9781479901135 |
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| تدمد: | 15417026 19381891 |
| DOI: | 10.1109/IRPS.2013.6532080 |