دورية أكاديمية
Capacitance Calculation for Via Structures Using an Integral Equation Method Based on Partial Capacitance
| العنوان: | Capacitance Calculation for Via Structures Using an Integral Equation Method Based on Partial Capacitance |
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| المؤلفون: | Wang, H., Pan, S., Kim, J., Ruehli, A. E., Fan, J. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(12):2134-2146 Dec, 2013 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2013.2272323 |