3D stacking for multi-core architectures: From WIDEIO to distributed caches

التفاصيل البيبلوغرافية
العنوان: 3D stacking for multi-core architectures: From WIDEIO to distributed caches
المؤلفون: Clermidy, F., Dutoit, D., Guthmuller, E., Miro-Panades, I., Vivet, P.
المصدر: 2013 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2013 IEEE International Symposium on. :537-540 May, 2013
Relation: 2013 IEEE International Symposium on Circuits and Systems (ISCAS)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781467357609
9781467357616
9781467357623
تدمد:02714302
21581525
DOI:10.1109/ISCAS.2013.6571899