مؤتمر
Thermo mechanical challenges for processing and packaging stacked ultrathin wafers
| العنوان: | Thermo mechanical challenges for processing and packaging stacked ultrathin wafers |
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| المؤلفون: | Gonzalez, Mario, Vandevelde, Bart, Manna, Antonio La, Swinnen, Bart, Beyne, Eric |
| المصدر: | 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :7-12 May, 2013 |
| Relation: | 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479902330 9781479902323 |
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| تدمد: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2013.6575543 |