مؤتمر
Thin silicon wafer processing and strength characterization
العنوان: | Thin silicon wafer processing and strength characterization |
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المؤلفون: | Gambino, Jeffrey P. |
المصدر: | Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the. :199-207 Jul, 2013 |
Relation: | 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781479912414 9781479904808 |
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تدمد: | 19461542 19461550 |
DOI: | 10.1109/IPFA.2013.6599153 |