مؤتمر
Failure analysis of a 2.5D stacking using μinsert technology
| العنوان: | Failure analysis of a 2.5D stacking using μinsert technology |
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| المؤلفون: | Nowodzinski, Antoine, Mandrillon, Vincent, Bouchu, David, Franiatte, Remi, Boutry, Herve, Bloch, Didier, Rousseau, Karine, Lionel, Chevalier |
| المصدر: | Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the. :427-432 Jul, 2013 |
| Relation: | 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479912414 9781479904808 |
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| تدمد: | 19461542 19461550 |
| DOI: | 10.1109/IPFA.2013.6599194 |