Putting the die contour back - Methods in advanced sample preparation for 3D and flip-chip devices

التفاصيل البيبلوغرافية
العنوان: Putting the die contour back - Methods in advanced sample preparation for 3D and flip-chip devices
المؤلفون: Richardson, Chris, Liechty, Gary, Smith, Clay, Karow, Michael
المصدر: Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the. :474-477 Jul, 2013
Relation: 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781479912414
9781479904808
تدمد:19461542
19461550
DOI:10.1109/IPFA.2013.6599203