دورية أكاديمية
A New High-Speed Memory Interconnect Architecture Using Microwave Interconnects and Multicarrier Signaling
| العنوان: | A New High-Speed Memory Interconnect Architecture Using Microwave Interconnects and Multicarrier Signaling |
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| المؤلفون: | Bensalem, B., Aberle, J. T. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 4(2):332-340 Feb, 2014 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2013.2283234 |