مؤتمر
Thermal-structural analysis considering contact stress between KO HCCR TBM sub-modules for ITER
| العنوان: | Thermal-structural analysis considering contact stress between KO HCCR TBM sub-modules for ITER |
|---|---|
| المؤلفون: | Shin, Kyu In, Lee, Dong Won, Jin, Hyung Gon, Lee, Eo Hwak, Kim, Suk-Kwon, Yoon, Jae Sung, Ahn, Mu-Young, Cho, Seungyon |
| المصدر: | 2013 IEEE 25th Symposium on Fusion Engineering (SOFE) Fusion Engineering (SOFE), 2013 IEEE 25th Symposium on. :1-4 Jun, 2013 |
| Relation: | 2013 IEEE 25th Symposium on Fusion Engineering (SOFE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479901692 9781479901715 |
|---|---|
| تدمد: | 10788891 21559953 |
| DOI: | 10.1109/SOFE.2013.6635424 |