دورية أكاديمية
Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module
| العنوان: | Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module |
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| المؤلفون: | Warnock, J., Chan, Y., Harrer, H., Carey, S., Salem, G., Malone, D., Puri, R., Zitz, J. A., Jatkowski, A., Strevig, G., Datta, A., Gattiker, A., Bansal, A., Mayer, G., Chan, Y.-H., Mayo, M., Rude, D. L., Sigal, L., Strach, T., Smith, H. H., Wen, H., Mak, P.-K., Shum, C.-L., Plass, D., Webb, C. |
| المصدر: | IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 49(1):9-18 Jan, 2014 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 00189200 1558173X |
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| DOI: | 10.1109/JSSC.2013.2284647 |