دورية أكاديمية
A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability
| العنوان: | A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability |
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| المؤلفون: | Okoro, C., Lau, J. W., Golshany, F., Hummler, K., Obeng, Y. S. |
| المصدر: | IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 61(1):15-22 Jan, 2014 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 00189383 15579646 |
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| DOI: | 10.1109/TED.2013.2291297 |