مؤتمر
Laser backside contact annealing of SiC power devices: A prerequisite for SiC thin wafer technology
العنوان: | Laser backside contact annealing of SiC power devices: A prerequisite for SiC thin wafer technology |
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المؤلفون: | Rupp, R., Kern, R., Gerlach, R. |
المصدر: | 2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on. :51-54 May, 2013 |
Relation: | 2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781467351348 9781467351355 9781467351362 |
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تدمد: | 10636854 19460201 |
DOI: | 10.1109/ISPSD.2013.6694396 |